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第二、三代镍基单晶高温合金含Hf过渡液相(TLP)连接
发布人：上海艾荔艾金属材料有限公司www.shailiai.com
更新时间：2016-01-05
采用无 B 的含 Hf 镍基合金作为中间层合金, 分别对含 Re 的第二代镍基单晶高温合金 (CMSX-4, 铸态) 和第三代镍基单晶高温合金 (SXG3, 完全热处理态) 进行 TLP 连接, 并分析了连接区的显微组织演变以及降熔元素分布, 测试了连接区的显微硬度.
第二、三代镍基单晶高温合金含Hf过渡液相(TLP)连接TRANSIENT LIQUID PHASE BONDING OF SECOND AND THIRD GERNERATION Ni-BASED SINGLE CRYSTAL SUPERALLOY WITH Hf-CONTAINING INTERLATYER ALLOY
采用无 B 的含 Hf 镍基合金作为中间层合金, 分别对含 Re 的第二代镍基单晶高温合金 (CMSX-4, 铸态) 和第三代镍基单晶高温合金 (SXG3, 完全热处理态) 进行 TLP 连接, 并分析了连接区的显微组织演变以及降熔元素分布, 测试了连接区的显微硬度. 结果表明, 在 1290 ℃真空保温 24 h 后, CMSX-4 和 SXG3 合金的 TLP 连接均已完成, 2 种合金的 TLP 连接过程也均符合经典模型. 以含 Hf 的镍基合金作为中间层合金时, 在连接区内没有出现扩散影响区. CMSX-4 合金的固溶处理可在 TLP 连接过程中同步完成, 缩短了热处理工艺. SXG3 合金中的 C 与 Hf 结合在液相中形成固相 HfC, 降低熔体中 Hf 浓度, 缩短了等温凝固阶段的时间. 研究表明, 通过 TLP 连接可以研究小角度晶界的界面稳定性, 其中在 1150 ℃保温热处理后, SXG3 合金小角度晶界出现不连续脱溶转变的临界区间在 10°~17°之间.
A Hf-containning Ni-based alloy was used as the interlayer alloy of TLP bonding for the 2nd (CMSX-4, as-cast condition) and 3rd (SXG3, standard heat treatment condition) generation Ni-based single crystal superalloys containing Re in this work, and the microstructure, composition and micro-hardness of bonding zone were characterized. The results show that the TLP bonding of CMSX-4 and SXG3 alloy were completed after bonded at 1290 ℃ in vacuum for 24 h. These TLP bonding process of CMSX-4 and SXG3 alloys can be explained well using classical TLP model. The diffusion affected zone was not observed during the TLP bonding process. In addition, the heat treatment process of CMSX-4 is shortened by 24 h resulted from the solid solution heat treatment of CMSX-4 alloy has been completed after the process of TLP bonding. The isothermal solidification stage of SXG3 alloy was also accelerated due to the precipitation of HfC at the bonding temperature, resulting in the reduced Hf concentration of Hf in the melting zone. Our study also indicates that the interfacial stability of low angle grain boundaries can be investigated by the TLP bonding. The critical misorientation value for discontinuous precipitation of SXG3 alloy along low angle grain boundaries was in between 10º and 17º after heat treatment at 1150 ℃.
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