W/CuCrZr钨铜合金热等静压焊接Hot isostatic pressing joining of W/CuCrZr alloy

采用热等静压(HIP)焊接技术制备W/CuCrZr偏滤器部件焊接模块，分别研究以物理气相沉积(PVD)制备的40 μm铜涂层作为过渡层，以2 mm厚的TU1铜片作为过渡层以及无过渡层3种结构模块的焊接界面质量。通过扫描电子显微镜(SEM)、超声波无损探伤仪(NDT)、力学拉伸试验机和电子束高热负荷试验装置分别对焊接模块的微观形貌、焊接缺陷、力学性能和高热负荷性能进行检测分析。结果表明：HIP焊接工艺参数为(940 ℃, 120 MPa, 2 h)时，采用40 μm铜涂层为过渡层的模块焊接界面结合质量最高，且没有缺陷，经过入射功率密度为20 MW/m²的高热负荷试验也没有失效。因此，该工艺是3种工艺参数下钨/铜合金偏滤器模块制造的最佳制备技术。

The W/CuCrZr alloy divertor component module was manufactured by hot isostatic pressing (HIP) technique. The interface properties of three modules which have the interlayers with 40 μm thick Cu coating produced by PVD method, 2 mm thick TU1Cu sheet and no interlayer, respectively, were investigated. The microstructure, welding defect, shear strength and high heat load(HHL) test properties were tested by scanning electron microscope (SEM), ultrasonic nondestructive testing (NDT) equipment, mechanical cupping machine and electron beam epuipment(EMS-60), respectively. The results show that the joint performance of module with the interlayer of 40 μm thick Cu coating is the best, the highest bonding strength and free defect are achieved under the HIP condition of (940 ℃, 120 MPa, 2 h). After the screening test with incident power density of 20 MW/m², the module also has no failure. Therefore, the process can be the optimal technique applied to the manufacturing of divertor component among the three techniques.

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